- 封装芯片:Philips I-CODE-2 (I-CODE-SLI )
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- 标签厚度: 0.28mm
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- 存储容量:1024 bit,16个分区,64 bit 唯一ID序列号
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- 工作频率:13.56KHz
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- 读写距离:3-10cm
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- 工作温度:-20℃~55℃
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- 擦写寿命:>100,000次
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- 执行标准:ISO15693
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- 封装材料:格拉辛纸、牛皮纸 聚酯PET 铜版纸 聚乙烯polyC
- 外形尺寸:50X0X0.28MM,【可根据客户要求订做】
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产品实拍图 联系人:曾庆健 手机:13828750073 QQ:2873338237
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产品颜色系列图 联系人:曾庆健 手机:13828750073 QQ:2873338237
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NXP I CODE SLE不干胶电子标签的结构:
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把标签的天线嵌进塑料物体当中通常采用蚀刻,电镀技术:嵌入到纸张当中则采用胶版印刷、丝网印刷和胶印技术。仅通过一个简单的热蒸发过程就可以让铝质线圈天线在纸上成形,并组成完整的RFID标签。铝比铜或银更便宜,目前已经在各种标签广泛使用。研究表明,该方法会降低五分之一的成本。不干胶电子标签用纸、合成纸或PET作为基层材料,采用银天线印刷工艺制作,单层结构,不需制作Inlay。
NXP I CODE SLE不干胶电子标签的典型应用:················································································································································································
物流管理,商品零售业,产品跟踪,产品防伪,仓储管理,生产控制,车辆管理等。例如:医药行业-药瓶管理;珠宝行业-库存管理和防盗;白酒行业-销售跟踪和防盗等。
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